International Conference on Planarization/CMP Technology

ICPT is the annual high-level conference covering all aspects of Chemical-Mechanical Polishing (CMP). It has been founded by a co-operation of the CMP Users Groups of Europe, Japan, Korea, Taiwan and the United States, and it takes place alternatively on each region.

After very successful conferences in the US and in Asia in recent years, ICPT 2012 takes place again in Europe. The scope of the conference is to gather CMP community, end users from semiconductor industry, suppliers and research institutes. Experts from all over the world exchange information and state-of-the-art research in CMP technology.

Future strategies in microelectronics and microsystems will be introduced during the plenary talks: “CMOS Evolutions and CMP applications” by Dominique Labrunye (Silicon Technology R&D Director at STMicroelectronics) and “Disruptive Planar & 3D Solutions for Energy Efficiency” by Laurent Malier (CEO of CEA-Leti).

The CMP sessions will be opened by renowned experts from major semiconductor chip makers: Mansour Moinpour (Intel Corp.), Jinok Moon (Samsung Electronics), Yongsik Moon (GlobalFoundries) – and from research institutes – Katia Devriendt / Patrick Ong (IMEC), Keiichi Kimura (Kyushu Institute of Technology) and Xin-Ping Qu (Fudan University of Shanghai).

The talks will cover front-end CMP processes for 28nm and beyond, challenges in CMP processes for 14nm logic technology, step-height reduction of 28nm Ceria particle slurry depending on pad surface profile, interaction of surface chemistry and adsorption behavior of CMP abrasives, new explanations of the material removal process in CMP and CMP processes for future materials like Co and Mo. Beside 32 oral talks, two poster sessions are organized in order to allow presenting all of the large amount of papers submitted.

Also, most significant CMP innovative products available on market will be exhibited for duration of events in the recreation and posters presentation areas.