Forum für Wissenschaft, Industrie und Wirtschaft

Hauptsponsoren:     3M 
Datenbankrecherche:

 

International coveted award in the field of microelectronics

07.10.2014

IEEE Jewell James Ebers Award 2014 for Professor Joachim N. Burghartz

The head of the Institute for Nano and Microelectronic Systems (INES) at the University of Stuttgart and Director of the Stuttgart Institute for Microelectronics (IMS CHIPS), Prof. Joachim N. Burghartz, is being presented with the J.J. Ebers Award.


Professor Joachim N. Burghartz

University of Stuttgart

This prestigious special award in the field of microelectronics is thus being awarded to a European researcher again for the first time in over 30 years. Prof. Burghartz is being awarded the prize for his work on coils integrated on silicon chips and for the development of technologies and applications of ultra-thin silicon chips in flexible electronics. The prize awarded by the IEEE Electron Devices Society, the worldwide association of electrical engineers, will be officially awarded on 15th December 2014 in San Francisco at the opening of the globally leading International Electron Devices Meeting (IEDM). 

Prof. Wolfram Ressel, Rector of the University of Stuttgart offered his congratulations on the award and said: “The award presented by J.J. Ebers Awards to Joachim Burghartz is a source of great pleasure to us. It is initially the personal recognition of the great research work performed by Professor Burghartz. However, it is moreover evidence of the excellent achievements in microelectronics at the science location of Stuttgart.“

Nils Schmid, Minister for Economic Affairs in the State of Baden-Württemberg, congratulated Prof. Burghartz: “I congratulate Professor Burghartz on his excellent research work finding such wide recognition internationally. This success proves the quality of this top-class research performed at our economy-oriented research institutes in Baden-Württemberg.“

The breakthrough on the integration of coils on a silicon chip can be traced back to Burghartz’ research work at IBM in the USA and a publication at the IEDM in 1995. This contributed to laying the foundation for today’s chips in the field of wireless communication technology that is used in mobile phones, laptops and many other electronic products.

In the 10 years following this, during IBM research in the USA and at the Delft University of Technology in the Netherlands, Burghartz promoted the technology of the communication chip with other decisive contributions. After moving to Stuttgart in 2005 in order to head the Institute for Microelectronics Stuttgart (IMS CHIPS), an institute in the Innovation Alliance Baden-Württemberg (innBW), and simultaneously the Institute for Nano and Microelectronic Systems (INES) at the University of Stuttgart, he dedicated his energies to the manufacturing, characterisation and application of ultra-thin silicon chips for flexible electronics. This new technology also has the potential for innovative electronic products, such as, e.g. flexible TV screens. Joachim Burghartz received the State Research Prize Baden-Württemberg in 2009.

Both contributions mentioned in dedicating the award have a special significance for the objectives of “Industrie 4.0“, the fourth revolution in industrial automation, in which German industry sees a unique opportunity to further expand the international leadership in mechanical engineering, in automobile production and in many other sectors. The basis of this change in direction concerns sensor chips that are able to transmit measurement data in a wireless way and that can be attached to components flexibly and with minimum space requirements. This enables products to be personalised in volume production and produced in good time, as well as internationally distributed production chains being able to be controlled in an optimum way.

About Prof. Burghartz:
Joachim Burghartz was born in Aachen in 1956. He studied electrical engineering at the RWTH Aachen, graduating as a qualified engineer (Dipl.-Ing.) in 1982. He obtained his doctorate in 1987 from the University of Stuttgart. He subsequently joined the internationally renowned research laboratory of IBM, T.J. Watson Research Center in New York in the USA, for 11 years. Then he worked as a full professor for 8 years at Delft University of Technology in the Netherlands, where he was also the scientific director of the inter-faculty Micro-Electronics Institute DIMES for four years. He returned to Stuttgart in 2005. Today he heads the Institute for Nano and Microelectronic Systems (INES) at the University of Stuttgart as a full professor, as well as the Stuttgart Institute for Microelectronics (IMS CHIPS), an institute in the Innovation Alliance Baden-Württemberg (innBW).

Contact:

Dr. Hans-Herwig Geyer, Head of University Communication and Press Spokesperson, University of Stuttgart,
Tel.: 0711/685-82555, Email: hans-herwig.geyer [at] hkom.uni-stuttgart.de

Andrea Mayer-Grenu | idw - Informationsdienst Wissenschaft
Weitere Informationen:
http://www.uni-stuttgart.de/

Weitere Nachrichten aus der Kategorie Förderungen Preise:

nachricht Innovationspreis 2017 der Deutschen Hochschulmedizin e.V.
24.04.2017 | Deutsche Hochschulmedizin e.V.

nachricht EU-Förderung in Millionenhöhe für Regensburger Wissenschaftler
21.04.2017 | Universität Regensburg

Alle Nachrichten aus der Kategorie: Förderungen Preise >>>

Die aktuellsten Pressemeldungen zum Suchbegriff Innovation >>>

Die letzten 5 Focus-News des innovations-reports im Überblick:

Im Focus: Nanoskopie auf dem Chip: Mikroskopie in HD-Qualität

Neue Erfindung der Universitäten Bielefeld und Tromsø (Norwegen)

Physiker der Universität Bielefeld und der norwegischen Universität Tromsø haben einen Chip entwickelt, der super-auflösende Lichtmikroskopie, auch...

Im Focus: Löschbare Tinte für den 3-D-Druck

Im 3-D-Druckverfahren durch Direktes Laserschreiben können Mikrometer-große Strukturen mit genau definierten Eigenschaften geschrieben werden. Forscher des Karlsruher Institus für Technologie (KIT) haben ein Verfahren entwickelt, durch das sich die 3-D-Tinte für die Drucker wieder ‚wegwischen‘ lässt. Die bis zu hundert Nanometer kleinen Strukturen lassen sich dadurch wiederholt auflösen und neu schreiben - ein Nanometer entspricht einem millionstel Millimeter. Die Entwicklung eröffnet der 3-D-Fertigungstechnik vielfältige neue Anwendungen, zum Beispiel in der Biologie oder Materialentwicklung.

Beim Direkten Laserschreiben erzeugt ein computergesteuerter, fokussierter Laserstrahl in einem Fotolack wie ein Stift die Struktur. „Eine Tinte zu entwickeln,...

Im Focus: Leichtbau serientauglich machen

Immer mehr Autobauer setzen auf Karosserieteile aus kohlenstofffaserverstärktem Kunststoff (CFK). Dennoch müssen Fertigungs- und Reparaturkosten weiter gesenkt werden, um CFK kostengünstig nutzbar zu machen. Das Laser Zentrum Hannover e.V. (LZH) hat daher zusammen mit der Volkswagen AG und fünf weiteren Partnern im Projekt HolQueSt 3D Laserprozesse zum automatisierten Besäumen, Bohren und Reparieren von dreidimensionalen Bauteilen entwickelt.

Automatisiert ablaufende Bearbeitungsprozesse sind die Grundlage, um CFK-Bauteile endgültig in die Serienproduktion zu bringen. Ausgerichtet an einem...

Im Focus: Making lightweight construction suitable for series production

More and more automobile companies are focusing on body parts made of carbon fiber reinforced plastics (CFRP). However, manufacturing and repair costs must be further reduced in order to make CFRP more economical in use. Together with the Volkswagen AG and five other partners in the project HolQueSt 3D, the Laser Zentrum Hannover e.V. (LZH) has developed laser processes for the automatic trimming, drilling and repair of three-dimensional components.

Automated manufacturing processes are the basis for ultimately establishing the series production of CFRP components. In the project HolQueSt 3D, the LZH has...

Im Focus: Wonder material? Novel nanotube structure strengthens thin films for flexible electronics

Reflecting the structure of composites found in nature and the ancient world, researchers at the University of Illinois at Urbana-Champaign have synthesized thin carbon nanotube (CNT) textiles that exhibit both high electrical conductivity and a level of toughness that is about fifty times higher than copper films, currently used in electronics.

"The structural robustness of thin metal films has significant importance for the reliable operation of smart skin and flexible electronics including...

Alle Focus-News des Innovations-reports >>>

Anzeige

Anzeige

IHR
JOB & KARRIERE
SERVICE
im innovations-report
in Kooperation mit academics
Veranstaltungen

„Microbiology and Infection“ - deutschlandweit größte Fachkonferenz in Würzburg

25.04.2017 | Veranstaltungen

Berührungslose Schichtdickenmessung in der Qualitätskontrolle

25.04.2017 | Veranstaltungen

Forschungsexpedition „Meere und Ozeane“ mit dem Ausstellungsschiff MS Wissenschaft

24.04.2017 | Veranstaltungen

 
VideoLinks
B2B-VideoLinks
Weitere VideoLinks >>>
Aktuelle Beiträge

„Microbiology and Infection“ - deutschlandweit größte Fachkonferenz in Würzburg

25.04.2017 | Veranstaltungsnachrichten

Auf dem Weg zur lückenlosen Qualitätsüberwachung in der gesamten Lieferkette

25.04.2017 | Verkehr Logistik

Digitalisierung bringt Produktion zurück an den Standort Deutschland

25.04.2017 | Wirtschaft Finanzen